Nano-Tec gold coated silicon wafers

IntroductionNano-Tec gold coated silicon wafers

The Nano-Tec gold coated silicon wafers are useful for thin film research, AFM / SPM, nanotechnology and biotechnology applications. The silicon wafers are coated with 50nm of pure gold over a 5nm adhesion layer of Ti. Both Ti and Au are deposited in a dedicated high vacuum deposition system with electron beam evaporation sources. The gold coating is not atomically flat; there are height differences in the nm range. The maximum use temperature is around 175°C; higher temperatures could result in delamination of the gold film. The Nano-Tec gold coated wafers are dividually packed in 2''wafer carrier trays for protection.


Specifications of the Nano-Tec  gold coated Ø2”/51mm silicon wafers:

Coating film 50nm Au, 99.999% purity
Adhesion film 5nm Ti, 99.98% purity
Surface roughness several nm
Si substrate Orientation <100>
Type P (Boron) with one primary flat
Resisantance 1-30 Ohm/cm
Thickness 275µm (+/- 20µm)
Diameter 51mm
TTV =< 20µm
Primary Flat 15.9 +/- 1.65mm

Gold Coated Si Wafer

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