Wafer Cleaving Pliers

Wafer cleaving plier



Wafer Cleaving Plier for working with mica

The wafer cleaving pliers are designed for making clean breaks in silicon wafers,thin glass,  thin quartz and similar materials. The can be used for either cleaving/breaking or nipping. These wafer cleaving pliers (also called glass running or glass breaking pliers) include two sets of jaw inserts:

  • A soft set with molded ridges to facilitate a clean break over a scored line. The white indication line on the jaws enables exact positioning over the scored line
  • A  flat metal set for nipping a thin strip along a parallel scored line

Made of lightweight, durable, strong reinforced plastic with ergonomically molded handles. Overall length is 152mm.

Wafer Cleaving Plier detailWafer Cleaving Pliers workingWafer Cleaving Pliers 

Technical Support Bulletins: wafer cleaving plier

1 Item(s)

1 Item(s)